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Schedule |
Dec.7(Wed) | Dec.8(Thu) | Dec.9(Fri) |
10:30-11:20 |
HITACHI HIGH-TECHNOLOGIES CORP. Introduction of the latest application of Hitachi CD-SEM |
HITACHI HIGH-TECHNOLOGIES CORP. Solution to Detect"Non-visible Defects""Nano-Prober"N-6000 innovates on LSI failure analysis. |
HITACHI HIGH-TECHNOLOGIES CORP. Introduction of the latest application of Hitachi CD-SEM |
11:30-12:20 |
RENESAS EASTERN JAPAN SEMICONDUCTOR, INC. The solution technology for SiP Die Bonder, Wafer sorter and NANOFLAT Wafer chuck |
JEOL LTD. An introduction of Failure Analysis tool with mechanical probes |
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12:30-13:20 |
YASKAWA ELECTRIC CORP. Introduction of the wafer sorter system/Introduction of the cylinder type linear motor |
NOAH CORPORATION 3-D USJ Devices analyzed with the Imago LEAP (Local Electrode Atom Probe microscope) |
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13:30-14:20 |
JEOL LTD. An introduction of Failure Analysis tool with mechanical probes |
NOAH CORPORATION ReVera RVX Technology for Gate Oxide Film, New QC and Metrology |
NOAH CORPORATION ReVera RVX Technology for Gate Oxide Film, New QC and Metrology |
14:30-15:20 |
NOAH CORPORATION 3-D USJ Devices analyzed with the Imago LEAP (Local Electrode Atom Probe microscope) |
THERMO ELECTRON K.K. Non-destructive Depth Analysis of Ultra Thin Films by Angle Resolved XPS and Max. Entropy Method |
OTSUKA ELECTRONICS CO., LTD. PFC emission analysis for the semiconductor and liquid crystal fields. - New approach - |
15:30-16:20 |
MARUBENI CORP. Single wafer cleaning system for BEOL and FEOL with Megasonic and Rotagoni dry |
Nano Geometry Research Inc. Introduction of Die-to-Database Verification Tool NGR2100 for Entire Printed Geometry of Die |
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Pagetop |
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Schedule |
Dec.7(Wed) | Dec.8(Thu) | Dec.9(Fri) |
10:30-11:20 |
HITACHI HIGH-TECHNOLOGIES CORP. Solution to Detect"Non-visible Defects""Nano-Prober"N-6000 innovates on LSI failure analysis. |
NITTO DENKO CORP. Introduce new cleaning method with the use of wafer-formed material called Chamber Maintenance Wafer |
HITACHI HIGH-TECHNOLOGIES CORP. Solution to Detect "Non-visible Defects""Nano-Prober"N-6000 innovates on LSI failure analysis. |
11:30-12:20 |
Litho Tech Japan Corporation Presentation of Litel new products for the TMAP(TM), DMAP(TM) and ACE(TM). |
NIHON VEECO K.K. Advancements in AFM Technology for Semiconductor Lithography, Etch and CMP Metrology |
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12:30-13:20 |
ALCATEL JAPAN LTD. Foup for One: speed up hot wafer in the probing industory |
BOC EDWARDS Atmosphric plasma abatement system |
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13:30-14:20 |
SEKI TECHNOTRON CORP. NEW TEST SYSTEM - DFT Approach & Competitive Advantages |
KEITHLEY INSTRUMENTS, K.K. Qualifying High K Gate Materials with Pulsed Charge Trapping Measurement |
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14:30-15:20 |
BOC EDWARDS Pumping and Abatement of Flammable Mixtures - Reducing the Risks |
SEKI TECHNOTRON CORP New Packaging Engineering--Sputter deposition system and Electro-deposition plating system |
MUSASHI ENGINEERING, INC. The dispense technology enables high precision ultra-small volume dispensing of line width18micron. |
15:30-16:20 |
FUJIKIN INC. integrated gas ssystems (igs) |
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Schedule |
Dec.7(Wed) | Dec.8(Thu) | Dec.9(Fri) |
10:30-11:20 |
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11:30-12:20 |
YOKOGAWA ELECTRIC CORP. Exploitation of RMS Technology toward the Total Process Management |
YOKOGAWA ELECTRIC CORP. The concepts and implementation of TDI package of e-fabDoctor series. |
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12:30-13:20 |
TAIYO NIPPON SANSO CO., LTD. Alternative cleaning gas C3F6 and Next Generation Low-k Material |
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13:30-14:20 |
KAWASHO ELECTRONICS CORP. Representation of HYT Vacuum In-Situ Particle Monitor(Primary Seminar.) |
EV GROUP JAPAN K.K. Introduce the EVG6200Infinity Mask Aligner with EVG's latest alignment technology,"Nano Align" |
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14:30-15:20 |
GSI Group Japan Corporation. (Formerly: GSI Lumonics Japan K.K.) Laser metal cut process of 1.0um pitch structure using 532nm laser technology |
KAWASHO ELECTRONICS CORP. Reperesentation of HYT Vacuum In-Situ Particle Monitor (Applied Ver.) |
FAB SOLUTIONS, INC. Asperation for EB-Scope |
15:30-16:20 |
SHIMADZU CORP. Applications of Physical Testing and Reliability Evaluation.In the Electric/Electrical field. |
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Schedule |
Dec.7(Wed) | Dec.8(Thu) | Dec.9(Fri) |
10:30-11:20 |
Sumitomo Chemical Co., Ltd. Recent R&D Status of Sumitomo's Photoresist |
SHIMADZU CORP. Novel X-ray Fluoroscopic and CT analysis method for high density packaging |
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11:30-12:20 |
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12:30-13:20 |
TORAY ENGINEERING CO., LTD. Introduction of Bump Inspection System Model:SP-500BW |
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13:30-14:20 |
READ CO., LTD. The processing tool for the next generation. ; CMP conditioner/Diamond wire |
Advantest Technology Solutions Corporation New Design Validation Test System for ICdesigner,certiMAX |
TUV RHEINLAND JAPAN LTD. Introduction of Functional Safety to Industrial Machinery and Semiconductor Production Equipment |
14:30-15:20 |
SAFE TECHNO LTD. Safety Design Update |
TORAY RESEARCH CENTER, INC. Analysis of LSI devices at TRC: Challenges to seeing invisible defects |
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15:30-16:20 |
JAPAN AIR GASES Ltd. NH3 Bulk-AVP Supply System and Large capacity NH3 abatement system |
JAPAN AIR GASES Ltd. CVD/ALD precursors for next generation |
JAPAN AIR GASES Ltd. NH3 Bulk-AVP Supply System and Large capacity NH3 abatement system |
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